A NOVEL LASER SLICING TECHNIQUE FOR DIAMOND SEMICONDUCTORS

THE NEW TECHNIQUE USES LASER PULSES TO SLICE DIAMONDS INTO THIN WAFERS, PAVING THE WAY FOR ITS ADOPTION AS A NEXT-GENERATION SEMICONDUCTOR MATERIAL.

Diamonds are promising materials for the semiconductor industry, but slicing them into thin wafers is challenging. In a recent study, a research team from Chiba University developed a novel laser-based technique for effortlessly slicing diamonds along the optimal crystallographic plane. Their findings will help make diamonds cost-effective semiconductors for highly efficient electric vehicle power conversion and high-speed communication technologies.

Silicon-based materials are currently the undisputed leaders in the field of semiconductors. Even so, scientists around the world are actively trying to find superior alternatives for next-generation electronics and high-power systems. Diamonds are among the most promising materials for applications such as fast telecommunications and power conversion in electric vehicles and power plants.