Next-generation bonding wires for the semiconductor industry

As a technology-driven manufacturer of bonding wires, Nippon Micrometal is providing new and innovative products to support the ever-changing semiconductor sector.

In the 35 years since it was founded, Japan-based Nippon Micrometal has established itself as a trusted, expert producer of bonding wires for semiconductors, catering for a growing portfolio of industry-leading semiconductor manufacturers. "The majority of our customers are overseas; and these customers are major players globally," explains Nippon Micrometal's president, Dr. Takashi Yamada.

"As a company, we have three key strengths, starting with the quality of our products," Dr. Yamada continues. "Our customers use our wires as the last step in their semiconductor production, so if the wire bonding were to fail, the whole process must be discarded and would be considered a waste. With that in mind, you can understand why reliability and high quality are essential to our business. Secondly, we provide aftercare to customers and should any issues arise when using our products, we are ready and willing to provide solutions for them. Technological support is one very strong advantage that we provide. Lastly, we conduct R&D in advance and consider potential future trends. With our cutting-edge technology, we develop our products tailored to individual companies' needs."