Eddy currents are swirling electrical currents created when a magnetic field is moved over a conducting metal, or the metal is moved through a magnetic field. George writes about his experiments using eddy currents to determine the layer thickness of copper on PCBs and aluminum and copper foils. He also describes a simple eddy current apparatus that he built using a PC, a single resistor, and a USB sound card to measure thickness.
Eddy currents are generated in a metallic object when a magnetizing coil with alternating current in its windings is brought close to the object. These remarkable eddy currents are one of the most extensively utilized electromagnetic concepts with applications including thickness measurement of metal plates or insulating coatings, detection of surface flaws or discontinuities, conductivity testing, and identification of metal alloys.
These methods provide low-cost, high-speed testing of metallic materials, without requiring direct coupling.
Over the years, many different techniques and devices have been used in these various applications. In this study I will focus on the ideas related to finding the thickness of a thin metal sheet or plate. Research has shown that there may be a direct way to achieve this goal. These efforts have led to the method employed here, which uses experimental data to determine how the terminal impedance of an eddy current (EC) sensor is related to a physical property of the material-in this case, the thickness of thin films. Here I focus on copper layer thickness on printed circuit boards (PCBs) and aluminum foil.
EC sensors can be very simple or complex depending on the job to be done.
For this project, single coil EC sensors were constructed. It was also found that lowcost, off-the-shelf devices could be easily repurposed for use as sensors.
This story is from the {{IssueName}} edition of {{MagazineName}}.
Start your 7-day Magzter GOLD free trial to access thousands of curated premium stories, and 9,000+ magazines and newspapers.
Already a subscriber ? Sign In
This story is from the {{IssueName}} edition of {{MagazineName}}.
Start your 7-day Magzter GOLD free trial to access thousands of curated premium stories, and 9,000+ magazines and newspapers.
Already a subscriber? Sign In
Renesas New RA8 Entry-Line MCU Groups Brings High Performance of Arm Cortex-M85 Processor to Cost-Sensitive Applications with Market-Leading CoreMark Performance
Renesas Electronics Corp., a premier supplier of advanced semiconductor solutions, introduced the RA8E1 and RA8E2 microcontroller (MCU) groups, extending the industry's most powerful series of MCUs.
Same Sky Expands AMT Absolute Encoder Line to Support Larger Shaft Sizes
Same Sky's Motion & Control Group announced the addition of a new series to its innovative AMT absolute encoder family designed to support larger motor shaft sizes from 9mm to 15.875mm (5/8 inch).
XP Power Launches New Series of Low-Profile, Baseplate-Cooled DC-DC Brick Converters
The RDF150 and RDF200 series are the latest additions to the RDF series of low-profile, baseplate-cooled, ultra-wide input DC-DC brick converters, which is already available in power outputs of 25W and 50W.
HMI Introduces Ultra-Low Voltage 12-bit GPIO Expander with Interrupt Output
HMI, a leading provider of advanced analog and power management technologies, announced the launch of its HL5310, an innovative ultra-low voltage 12-bit GPIO expander featuring interrupt output.
The Future of Embedded Chip Design Navigating the Chip Creation Space
Custom Silicon at Lower Cost, Reduced Development Time
The Long and Winding Road
From Maxim's RS-232 to WeMos ESP32: So Much to Do, So Little Time
Start to Finish Driving LCDs
Lumex Display with Microchip Driver for a TI MCU
Easing the Path for App Releases
Managed Development of React Native with Expo
Datasheet: Tiny Embedded Boards
Deliver Power, Performance, and Versatility in Meager Square Millimeters
Harvesting Ambient Energy
Hybrid Power Sources Cut IoT Battery Dependency