Hybridpack Drive – Modular Power Semicondcutor Solutions For EVS
Auto Tech Review|September 2019
For a fast and cost-efficient development of electric drivetrains, matching power modules for energy conversion and control in the main inverter are required. Infineon supplies new power modules, which enable inverter designs with powers ranging from 100 to 175 kW.
Maike Müller And Tomas Reiter
Hybridpack Drive – Modular Power Semicondcutor Solutions For EVS

E-MOBILTY – MAIN INVERTER MARKET TRENDS

Worldwide, the hybrid and electric vehicle (xEV) market is growing exponentially, showing the highest growth rates in the automotive sector for decades. This market trend is mainly driven by legislation on the reduction of emissions. Many upcoming standards will not penalize CO2 emissions of individual vehicles, but that of the entire fleet sold by an OEM. The European Union, for example, has set a limit of 95 g/km fleet average from 2021 and will reduce it to 59 g/km by 2030. As a result, car manufacturers need to electrify a wide range of vehicles – from small city cars to large long-range sedans and SUVs. OEMs and Tier 1 suppliers need scalable and cost-efficient solutions to meet those ambitious targets.

Infineon supports system suppliers with the widest product portfolio of power semiconductor solutions for xEV main inverters in the industry – ranging from chips to discrete solutions and entire modules. At the heart of Infineon’s xEV module portfolio stands the HybridPACK™ Drive. The lead product was introduced in 2017 and is now complemented with an entire product family 1 & 2. This power module family provides power scalability between 100 kW and 175 kW and an easy design-in concept to support Tier 1 suppliers and automotive OEMs in the development of a cost-effective platform approach for main inverters.

Adding to the spectrum, Infineon also introduced a 1,200 V Silicon IGBT chip in this product family, enabling higher vehicle working voltages necessary for fast charging purposes with battery voltages of 700 V or more. The demanding requirements of commercial, construction and agriculture vehicle (CAV) applications like buses and trucks can also be met. In a next step, the family will also implement Silicon Carbide chip technology, which achieves a doubled power density compared to Si based devices.

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