The rapid advancement in electronics has led to an ever-increasing demand for the protection of electronic devices from various environmental factors. Advanced materials such as epoxies, polyurethanes (PU), and polysiloxanes have emerged as frontrunners in this domain, offering excellent encapsulation, bonding, and thermal dissipation properties.
The continuous evolution of electronic devices, ranging from smartphones to complex industrial machinery, necessitates robust protection against moisture, heat, and physical damage. Advanced materials, including epoxies, PU, and polysiloxanes, have exceptional properties ensuring the longevity and reliability of electronic components.
Artificial intelligence (AI) and machine learning (ML) play a significant role in the proliferation of electronic devices and their consequential effect on the consumption of these advanced materials.
Uses of advanced materials
We have classified advanced materials based on three major uses, viz, encapsulants, bonding materials, and thermal dissipaters.
Encapsulants. Epoxies and PU-based encapsulants provide a protective layer, shielding electronic circuits from moisture, dust, and chemicals, ensuring operational integrity even in harsh environments. Encapsulants are crucial in applications where electronic devices are exposed to moisture or chemicals, or in situations where the components need to be isolated from the external environment.
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