Diamonds are promising materials for the semiconductor industry, but slicing them into thin wafers is challenging. In a recent study, a research team from Chiba University developed a novel laser-based technique for effortlessly slicing diamonds along the optimal crystallographic plane. Their findings will help make diamonds cost-effective semiconductors for highly efficient electric vehicle power conversion and high-speed communication technologies.
Silicon-based materials are currently the undisputed leaders in the field of semiconductors. Even so, scientists around the world are actively trying to find superior alternatives for next-generation electronics and high-power systems. Diamonds are among the most promising materials for applications such as fast telecommunications and power conversion in electric vehicles and power plants.
This story is from the September 2023 edition of Manufacturing Today.
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This story is from the September 2023 edition of Manufacturing Today.
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