Heat dissipation for high power density is an industry-wide challenge necessitating innovative technologies to disperse heat more effectively in data centres.
Advanced computational fluid dynamics (CFD) software is increasingly deployed to carry out simulations to predict the airspeed and temperature field of UPS components, boards, and systems to deliver an optimal heat dissipation solution.
This creates an ideal model for module layout, air channel design, fan selection, guiding printed circuit board (PCB) and structure design. Furthermore, such a simulation platform is also efficient and generates optimal results because it does not include processes necessary for traditional thermal design, such as manual estimation, verification, modification, and re-verification.
Such a multi-physical-field simulation platform can deliver a precision level that is 30 per cent higher than traditional models.
Bu hikaye Gulf Business dergisinin June 2021 sayısından alınmıştır.
Start your 7-day Magzter GOLD free trial to access thousands of curated premium stories, and 9,000+ magazines and newspapers.
Already a subscriber ? Giriş Yap
Bu hikaye Gulf Business dergisinin June 2021 sayısından alınmıştır.
Start your 7-day Magzter GOLD free trial to access thousands of curated premium stories, and 9,000+ magazines and newspapers.
Already a subscriber? Giriş Yap