Intel, 3DGS to set up $3.3 bn glass substrate unit in Odisha

Chip major Intel on Friday signed a pact with 3D Glass Solutions (3DGS) and the Odisha government to set up a $3.3 billion advanced packaging glass-core substrate manufacturing facility in the Bhubaneswar-Khurda region, officials said.

- HEMANT KUMAR ROUT & AASHISH ARYAN

Intel will support the project with technology know-how and process expertise, the government said in a press note.

The proposed project is among the largest high-technology manufacturing investments in the country, particularly in the semiconductor space. It is surpassed only by the $11 billion investment proposed by the Tata Group for building India’s first chip fabrication facility.

The memorandum of understanding aligns with the government's vision of developing the entire semiconductor manufacturing ecosystem in India, Union Electronics and Information Technology Minister Ashwini Vaishnaw said.

Officials said the project could trigger the emergence of a broader semiconductor ecosystem comprising upstream suppliers of speciality chemicals, advanced materials, capital equipment and glass substrates, as well as downstream electronics and system integration industries.

The proposed project, likely to come up over the next five to six years, is expected to generate 1,800 direct high-skill jobs.